ASTM B is standard Specification for Electrodeposited Copper for Engineering Uses. Browse our website for more details. This standard is issued under the fixed designation B; the 1 This specification is under the jurisdiction of ASTM Committee B08 on. q~tt-°eSignatiOn:B – 84 (Reapproved ). ChemResearch I This specification is under the iurisdiction of ASTM Committee B.H on. ~’Iic and Inorganic.
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ASTM does not give any warranty express or implied or make any representation that the contents asttm this abstract are accurate, complete or up to date.
Standards Subsctiption may be the perfect solution. Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. This specification does not cover electrodeposited copper used as a decorative finish, as an undercoat for other decorative finishes, or for electroforming.
This standard is not included in any packages. Coatings shall be sampled, tested, and shall conform to specified requirements as to appearance, thickness, porosity, solderability, adhesion, embrittlement relief, and packaging.
This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. It is informational only and not an official part of the standard; the full text of the standard itself must be referred to for its use and application.
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n734 You may delete a document from your Alert Profile at any time. This specification establishes the requirements for electrodeposited copper coatings used for engineering purposes including surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interference shielding in electronic circuitry, and in certain joining operations.
Nonmagnetic Coatings on Magnetic Basis Metals. This abstract is a brief summary of the referenced standard.
ASTM B734 – 97(2013)
Coatings shall be classified according to thickness. Metal parts asfm undergo pre- and post-coating treatment for reducing the risk of hydrogen embrittlement, and peening.
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ASTM B – Standard Specification for Electrodeposited Copper for Engineering Uses
Historical Version s – view previous versions of standard. We have no document history for this standard. Examples include surface hardening, heat xstm stop-off, as an underplate for other engineering coatings, for electromagnetic interferences EMI shielding in electronic circuitry, and in certain joining operations.
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Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences EMI atm in electronic circuitry, and in certain joining operations. Please first log in with a verified email before subscribing to alerts. This standard is also available to be included in Standards Subscriptions.